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中国绵阳•2019电磁兼容学术论坛会议通知
发表于 2019-09-29 | 5786次阅读 | 作者 | 来源

一.会议名称
中文名称:中国绵阳·2019电磁兼容学术论坛
英文名称:2019 Academic Forum on Electromagnetic Compatibility, Mianyang, China

二.会议简介
将于2019年10月8日在中国绵阳举办“中国绵阳·2019电磁兼容学术论坛”,此次学术论坛由金沙城娱乐场官网平台主办,金沙澳门游戏网址-金沙城娱乐场官网平台电磁兼容研究中心和西安电子科技大学超高速电路设计与电磁兼容教育部重点实验室承办。论坛期间,密苏里科技大学终身教授、讲席教授、密苏里科技大学电磁兼容实验室主任、美国国家科学基金委(NSF)产学联合电磁兼容研究中心主任、IEEE EMC杂志副主编、IEEE Fellow、范峻教授将主持会议,同时加拿大院士漆一宏北京邮电大学教授博导李书芳Intel公司首席工程师叶晓宁博士,谷歌高级硬件经理杨志平博士三星半导体公司蒲菠博士将分别做《High precision differential Beidou/GPS solution》、《EMC Analysis and Test Based on AI》、 《Signal Integrity Challenges in High Speed Interconnect》、《The Myth About Ground》和《More than Moore-High Speed Signal Design in 2.5D/3D Integrated Circuits》主题报告。通过举行本次学术论坛,将推动双一流学科的建设,特别是在信息学科建设、人才培养、科学研究等方面起到积极作用。提升金沙城娱乐场官网平台在电磁兼容、信号完整性、大功率无线充电技术等方面的国内外学术知名度,开阔金沙城娱乐场官网平台师生、科研工作者的学术视野,增强学校的科研氛围和师生荣誉感。本次EMC学术交流将为我校师生提供与学术大师零距离交流的机会,为后期的交流、合作、发展打下基础。
诚挚邀请学校师生参加!分享交流电磁干扰与防护、信号完整性与电源完整性分析、高速集成电路设计与封装技术、功率传输网络设计等领域的最新进展和研究成果。
 
会议时间:2019年10月8日9:00AM
会议地点:金沙城娱乐场官网平台行政楼302会议室
主  持 人:IEEE Fellow范峻教授
主办单位:金沙城娱乐场官网平台
承办单位:金沙澳门游戏网址-金沙城娱乐场官网平台电磁兼容研究中心
                  西安电子科技大学超高速电路设计与电磁兼容教育部重点实验室
报名方式:Email: zhuyuyu@swust.edu.cn (请于10月7日前将参会回执回复至该邮箱)
参加方式:免费参加,敬请光临。

三.会议时间表
 1、开始时间2019年10月8日9:00AM。主持人:范峻教授
 2、9:15-9:30    校领导致欢迎辞
 3、9:30-9:45    合影留念
 4、 9:45-10:30   特邀主题演讲1
 5、10:30-11:15  特邀主题演讲2
 6、11:15-11:30  茶歇
 7、 11:30-12:15  特邀主题演讲3
 8、 12:15-14:30  午餐及午休
 9、14:30-15:15  特邀主题演讲4
10、15:15-15:30 茶歇
11、15:30-16:15 特邀主题演讲5
12、16:15-16:45 研究生提问环节
13、16:45-17:30 会议闭幕式


 

2019 Academic Forum on Electromagnetic Compatibility, Mianyang, China
October 8, 2019
Mianyang, China

 

Keynote Talks:

1. Prof. Yihong Qi, Fellow of the Canadian Academy of Engineering, Adjunct Professor with Missouri University of Science and Technology, and an Adjunct Professor with Hunan University, “Accurate Differential BeiDou/GPS Positioning
Abstract: It was reported by CCTV in June 2019 that the BeiDou system has significantly improve its positioning accuracy from 10 meters to 6 meters. This was a breakthrough for satellite position system. There are applications, thus as structure health, need much better accurate positioning system to report structure small scale movement. An accurate, fast response and cost effective differential BeiDou/ GPS solution in presented in this talk. After a review of the differential BeiDou/ GPS technologies. A EDGE technology based relative differential BeiDou solution is illustrated. Electromagnetic compatibility receiver design plays an import role in the Accurate differential satellite positioning solutions.
 
2. Prof. Shufang LiProfessor of Beijing University of Posts and Communications (BUPT), “EMC Analysis and Test Based on AI
Abstract: Nowadays, EMC has penetrated into every electrical and electronic system and equipment. Almost all modern industries must solve the problem of EMC. The hotspot of the market has involved many new pillar industries, e.g., the fifth generation mobile communication, intelligent terminals, AR&VR, Internet of Things, big data, etc. Electromagnetic compatibility technology plays a strong driving role in the above industries, and improve the industries upgrade, and enhance the product competitiveness.
This report includes four parts, i.e., the importance of electromagnetic compatibility (EMC), the development and application of artificial intelligence (AI), the application scenario of AI in EMC, and the analysis and test of AI-based EMC. Firstly, the research hotspot and development direction of EMC are described. It is explained that EMC has penetrated into every electrical and electronic system and equipment. Almost all modern industries must solve the problem of EMC. Through the case of “New Challenge of Intelligent Network-connected Vehicle Safety”, the challenge EMC faces is complex electricity. The test data in magnetic environment need to be analyzed and processed efficiently. Next, the development history and application of artificial intelligence (AI) are described, which makes people realize the development of AI in different periods. Moreover, the application scenarios of AI in EMC are listed, e.g., the spectrum management and EMC decision-making by using artificial intelligence/expert system technology. The application of in-depth learning in the fast prediction of TDR impedance through high-speed differential holes is also discussed. Finally, the related research results of AI-based EMC analysis and testing, including, the electromagnetic environment of smart home, the study on methods and equipment for sensing and evaluating and locating ground interference sources using aircraft scattering signals are described.

 

 

 
3. Dr. Xiaoning YePrincipal Engineer in Data Center Group, Intel Corporation, “Signal Integrity Challenges in High Speed Interconnect
Abstract: The data rates of high-speed interconnect have grown exponentially over the last two decades, to meet ever-increasing performance requirements in computer systems. The electrical performance of printed-circuit-boards (PCBs) and related interconnect are now becoming ever crucial for high speed interconnect design. In this talk, we will discuss some critical non-ideal effects in PCB interconnect that significantly compromise the electrical performance at high frequencies (10GHz and above). The PCB and interconnect industry are facing these challenges and we will discuss some of the latest developments to address these effects. Another challenge in the industry is how the test methods can keep up with the highly-demanding accuracy requirement at ultra high frequencies. Test-fixtures are often needed to connect DUT to instruments, while these test-fixtures can easily lead to inaccurate measurement results. In this talk, we will briefly introduce the IEEE standard development work P370, and how it can help to solve this common industry problem.
 
4. Dr. Zhiping YangSenior Hardware Manager in Google Consumer Hardware Group, Senior Manager in Apple, “The Myth About Ground
Abstract: GROUND is widely used in high-speed circuit modeling and simulation. However, there are a lot of misconceptions and misunderstandings about ground in the high-speed circuit industry. Does ideal ground really exist? If not, why do we use it in simulations? Should we connect the reference node of S-parameter model to ideal ground? Is ground bounce real and well defined? What can we do or cannot do with S-parameter model? These questions are commonly asked by high-speed circuit designers. Answers from different people may be quite different and even contradictory. In this presentation, these questions will be answered with some simple, but powerful examples.
 
5. Dr. Bo PuStaff Engineer & Manager in Samsung Semiconductor Korea R&D Center, More than Moore-High Speed Signal Design in 2.5D/3D Integrated Circuits
Abstract: The 3D integration provides a possibility to continuously enlarging the density of ICs, and More than Moore conception is getting a growing number of attentions recently. Among a large amount of more than Moore technologies, 2.5D interposer and Through Silicon Via (TSV) for 3D ICs are playing irreplaceable significant role. The 2.5D interposer becomes a crucial solution to realize grand bandwidth of HBM for the increasing data requirement of high performance computing (HPC) and Artificial Intelligence (AI) applications. To overcome high speed switching bottleneck caused by the large resistive and capacitive characteristics of interposer, design methods to achieve an optimized performance in a limited routing area are proposed. Unlike the conventional single through silicon via (TSV) as a signal channel, considering the reliability, multiple TSV are used in real chip as the robust 3D interconnects for each signal path. An equivalent model to accurately describe the electrical characteristics of the multiple TSVs is proposed, and a configuration pattern strategy of TSV to mitigate crosstalk is also discussed.


 

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